キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2016,
Senic D, Sarolic A, Joskiewicz ZM, Holloway CL
IEEE Trans Electromagn Compat 58 (3): 721-728
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2022,
Shah IA, Basir A, Cho Y, Yoo H
IEEE Trans Electromagn Compat 64 (3): 640-649
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2021,
Shah IA, Cho Y, Yoo H
IEEE Trans Electromagn Compat 63 (3): 681-691
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IEEE Trans Electromagn Compat 62 (2): 338-345
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[LTE端末のSAR値分析]
[tech./dosim.]
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 1-4; ISBN 978-1-4673-0717-8
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2017,
Shi J, Chakarothai J, Wang J, Wake K, Fujiwara O, Watanabe S
2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing), Beijing, China. IEEE; ISBN 978-1-5090-5186-1
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2021,
Shiina T, Kudo T, Herai D, Kuranari Y, Sekiba Y, Yamazaki K
IEEE Trans Electromagn Compat 63 (6): 1812-1819
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2019,
Shiina T, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 744-747; ISBN 978-1-7281-1639-6
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2014,
Shiina T, Suzuki Y, Kasai Y, Inami Y, Taki M, Wake K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 166-169; ISBN 978-4-88552-287-1
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2023,
Shikhantsov S, Thielens A, Vermeeren G, Demeester P, Martens L, Joseph W
IEEE Trans Electromagn Compat 65 (4): 960-971