キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2022,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A, Shakinka I
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 537-542; ISBN 978-1-6654-0789-2
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2022,
Pavel I, David V, Roman MG, Bordas AM
2022 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: pp. 484-488; ISBN 978-1-6654-8995-9
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2022,
Xia M, Guo R, Zheng J, Chen J
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Spokane, WA, USA. IEEE: pp. 610-613; ISBN 978-1-6654-0930-8
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2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), Chengdu, China. IEEE: pp. 319-322; ISBN 978-1-6654-2776-0
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2022,
Diao Y, Rashed EA, Hirata A
IEEE Trans Electromagn Compat 64 (6): 1969-1977
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2022,
Colombi D, Ghasemifard F, Joshi P, Xu B, Di Paola C, Törnevik C
IEEE Trans Electromagn Compat 64 (6): 1986-1993
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2022,
ElShami IF, Elwrfalli K, Elgayar AI, Elgaud MM, Yousuf FH, Elmangosh N
2022 International Conference on Engineering & MIS (ICEMIS), Istanbul, Turkey. IEEE: pp. 1-5; ISBN 978-1-6654-5437-7
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2022,
Li S, Jiang Y, Tang C, Luo Z, Liu L, Li Z, Gu C
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Beijing, China. IEEE: pp. 563-565; ISBN 978-1-6654-1672-6
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 525-530; ISBN 978-1-6654-0789-2
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2022,
Silla G, Bastianelli L, Colella E, Moglie F, Primiani VM
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: pp. 151-156; ISBN 978-1-6654-0789-2