キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2018,
Paganoto PS, Hagedorn MP, da Silva JR
2017 IEEE 3rd Global Electromagnetic Compatibility Conference (GEMCCON), Sao Paulo, Brazil. IEEE: 1-5; ISBN 978-1-5386-2992-5
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2018,
Kosterec M, Kurimský J, Vargová B
2018 19th International Scientific Conference on Electric Power Engineering (EPE), Brno, Czech Republic. IEEE: 1-6; ISBN 978-1-5386-4613-7
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2018,
Douglas MG, Pfeifer S, Kuehn S, Neufeld E, Pokovic K, Carrasco E, Samaras T, Christ A, Capstick M, Kuster N
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 92-94; ISBN 978-1-5090-3955-5
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2018,
Fukui S, Maeda N, Xiao F, Kami Y
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 331-335; ISBN 978-1-5090-3955-5
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2018,
Munhoz-Rojas PE, Segura-Salas CS, Costa AA, Martins R, Hoffmann-Neto J
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 1267-1273; ISBN 978-1-5090-3955-5
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2018,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 872-874; ISBN 978-1-5090-3955-5
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2018,
He Y, Sun W, Leung PSW, Siu TYM, Ng KT
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 936-939; ISBN 978-1-5090-3955-5
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2018,
Koh WJ, Moochhala SM
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 518-522; ISBN 978-1-5090-3955-5
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2018,
Vargová B, Majláth I, Kurimský J, Cimbala R, Kosterec M, Tryjanowski P, Jankowiak Ł, Raši T, Majláthová V
Exp Appl Acarol 75 (1): 85-95
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2018,
Zhang K, Du L, Zhu Z, Song B, Xu D
IEEE Trans Electromagn Compat 60 (4): 829 - 839