-
2019,
Werner R, Knipe P, Iskra S
IEEE Access 7: 170682-170689
-
2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 83-86; ISBN 978-1-7281-1639-6
-
2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 48-51; ISBN 978-1-7281-1639-6
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std C95.1-2019: 1-312, ISBN 978-1-5044-5548-0
-
2019,
Cresci A, Paris CB, Foretich MA, Durif CM, Shema SD, O'Brien CE, Vikebø FB, Skiftesvik AB, Browman HI
iScience 19: 1173-1178
-
2019,
Christopoulou M, Karabetsos E
Bioelectromagnetics 40 (8): 602-605
-
2019 42nd International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO), Opatija, Croatia. IEEE: 486-490; ISBN 978-1-5386-9296-7
-
2019,
Revenko SV, Tikhomirova LN, Gavrilov IY, Tarakanov IA
Bull Exp Biol Med 167 (3): 305-310
-
2019,
Truong BT, Blankenstein FH
Radiologe 59 (10): 912-919
-
2019,
Alsafi A, Jackson JE, Fatania G, Patel MC, Glover A, Shovlin CL
Br J Radiol 92 (1098): 20180752