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2020 13th International Congress on Image and Signal Processing, BioMedical Engineering and Informatics (CISP-BMEI), Chengdu, China. IEEE: 619-623; ISBN 978-0-7381-0546-8
2020,
Piras C, Conte S, Pibiri M, Rao G, Muntoni S, Leoni VP, Finco G, Atzori L
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), Reno, NV, USA. IEEE: 257-260; ISBN 978-1-7281-7431-0