キーワード:
磁界強度, "magnetische Feldstärke", H-Feld, "magnetic field strength", "H field"
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2019,
Fey DP, Jakubowska M, Greszkiewicz M, Andrulewicz E, Otremba Z, Urban-Malinga B
Aquat Toxicol 209: 150-158
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2019,
Crespi CM, Swanson J, Vergara XP, Kheifets L
Environ Res 171: 530-535
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2019,
Bodewein L, Schmiedchen K, Dechent D, Stunder D, Graefrath D, Winter L, Kraus T, Driessen S
Environ Res 171: 247-259
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2019,
Tang C, Yang C, Cai RS, Ye H, Duan L, Zhang Z, Shi Z, Lin K, Song J, Huang X, Zhang H, Yang J, Cai P
Sci Total Environ 654: 535-540
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2019,
Yamaguchi T, Abe Y, Ichino Y, Satoh S, Masuda T, Kimura S, Ito M, Yamamoto T
J Magn Reson Imaging 49 (2): 525-533
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2019,
Kamm K, Pomschar A, Ruscheweyh R, Straube A, Reiser MF, Hernádi I, László JF, Ertl-Wagner B
Eur J Pain 23 (2): 250-259
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2018,
Shuai CJ, Xie XC, Li RM, Wang XK
Acta Microsc 27 (3): 202-208
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2018,
Ma L, Zhang X, Ying BA, Wu L
Li Y, Gao L, Xu WL (eds.): 11th Textile Bioengineering and Informatics Symposium proceedings (TBIS 2018) : Manchester, United Kingdom, 25-28 July 2018. Curran Associates, Inc., Red Hook, NY; 205-211; ISBN 978-1-5108-7035-2
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2018,
Drandić A, Trkulja B
Engineering Analysis with Boundary Elements 91: 1-6
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2018,
Zaidi S, Khatoon S, Imran M, Zohair S
Pak J Bot 50 (6): 2237-2244
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2018,
Zeng X, Ma H, Pi C, Yang P, Yan S, Yuan S, Shi J, Zhang Y, Ma L, Pang S
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 24-27; ISBN 978-1-5090-3955-5
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2018,
Nesterova M, Nesterova Y
2018 IEEE 19th Wireless and Microwave Technology Conference (WAMICON), Sand Key, FL, USA. IEEE: 1-4; ISBN 978-1-5386-1268-2
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2018,
Martim HC, Vilarinho LO
Rev Soldag Insp 23 (2): 292-305
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2018,
Paras SD, Gajanin RB, Manojlovi ML, Ruzic ZN
Eskola H, Väisänen O, Viik J, Hyttinen J (eds.): EMBEC & NBC 2017: Joint Conference of the European Medical and Biological Engineering Conference (EMBEC) and the Nordic-Baltic Conference on Biomedical Engineering and Medical Physics (NBC), Tampere, Finland, June 2017. IFMBE Proceedings, 65巻; Springer, Singapore; 711-714; ISBN 978-981-10-5121-0
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2018,
Health Council of the Netherlands
The Hague: Health Council of the Netherlands,
publication no. 2018/08e: 1-44
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2018,
Liu X, Yin X, Yang Q
2018 International Conference on Intelligent Transportation, Big Data & Smart City (ICITBS), Xiamen, China. IEEE: 760-763; ISBN 978-1-5386-4202-3
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2018,
Aga K, Hirata A, Laakso I
2018 International Symposium on Electromagnetic Compatibility (EMC EUROPE), Amsterdam, Netherlands. IEEE: 515-520; ISBN 978-1-4673-9699-8
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International Telecommunication Union (ITU),
ITU-T Recommendations K-Series, K.61 (01/2018): 1-30
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2017 Computing in Cardiology (CinC), Rennes, France. IEEE: 1-4; ISBN 978-1-5386-4555-0
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2018,
Taguchi K, Laakso I, Aga K, Hirata A, Diao Y, Chakarothai J, Kashiwa T
IEEE Access 6: 70186 - 70196
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2018,
Bouleanu I, Miclaus S, Bechet AC, Bechet P, Sarbu A, Helbet R
2018 International Conference on Applied and Theoretical Electricity (ICATE), Craiova, Romania. IEEE: 1-4; ISBN 978-1-5386-3807-1
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2018,
Helbet R, Bechet AC, Stratakis D, Bechet P, Miclaus S
2018 International Conference and Exposition on Electrical And Power Engineering (EPE), Iasi, Romania. IEEE: 149-153; ISBN 978-1-5386-5063-9
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2018,
Ghazikhanlou-Sani K, Rahimi A, Poorkaveh M, Eynali S, Koosha F, Shoja M
Interv Med Appl Sci 10 (3): 121-126
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2018 International Symposium on Antennas and Propagation (ISAP), Busan, Korea (South). IEEE: 1-2; ISBN 978-1-5386-5389-0
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2018,
Rishpon A, Braun R, Weinstock MA, Kulju S, Grenga A, Navarrete-Dechent C, Marghoob NG, Steffel J, Marghoob AA
JAMA Dermatol 154 (10): 1204-1207