-
2019,
Lasalvia M, Perna G, Capozzi V
Appl Sci 9 (18): 3700
-
2019,
Mi Y, Liu Q, Li P, Xu J
Biomed Res Int 2019: 9654583
-
2019,
Frigura-Iliasa M, Olariu AF, Baloi FI, Frigura-Iliasa FM, Vatau D, Petrenci RC
2019 International Conference on ENERGY and ENVIRONMENT (CIEM), Timisoara, Romania. IEEE: pp. 82-85; ISBN 978-1-7281-1533-7
-
2019,
Rohde M, Ziebart J, Kirschstein T, Sellmann T, Porath K, Kühl F, Delenda B, Bahls C, van Rienen U, Bader R, Köhling R
Front Bioeng Biotechnol 7: 422
-
2019,
Vaessen EMJ, Timmermans RAH, Tempelaars MH, Schutyser MAI, den Besten HMW
Sci Rep 9: 19990
-
2019,
Rubin AE, Usta OB, Schloss R, Yarmush M, Golberg A
Adv Wound Care 8 (4): 136-148
-
2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 48-51; ISBN 978-1-7281-1639-6
-
2019,
Laakso I, Lehtinen T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 334-337; ISBN 978-1-7281-1639-6
-
2019,
Bechet AC, Helbet R, Miclaus S, Bouleanu I, Sarbu A, Bechet P
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1025-1029; ISBN 978-1-7281-0595-6
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std C95.1-2019: 1-312, ISBN 978-1-5044-5548-0
