2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 744-747; ISBN 978-1-7281-1639-6
2021,
Shikhantsov S, Guevara A, Thielens A, Vermeeren G, Demeester P, Martens L, Torfs G, Pollin S, Joseph W