Die folgenden Begriffe wurden einbezogen:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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Environmentalist 25 (2-4): 201-208
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2005,
Netzer MZ, Shechter A, Karni Z
Environmentalist 25 (2-4): 195-199
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Environmentalist 25 (2-4): 181-185
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2005,
Özgüner F, Altinbas A, Ozaydin M, Dogan A, Vural H, Kisioglu AN, Cesur G, Yildirim NG
Toxicol Ind Health 21 (9): 223-230
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Med Device Technol 16 (7): 24-25
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2005,
Loughran SP, Wood AW, Barton JM, Croft RJ, Thompson B, Stough C
NeuroReport 16 (17): 1973-1976
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2005,
Özgüner F, Oktem F, Ayata A, Koyu A, Yilmaz HR
Mol Cell Biochem 277 (1-2): 73-80
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2005,
Reyhani SM, Ludwig SA
Electromagnetics 25 (2): 93-114
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2004,
Ayata A, Mollaoglu H, Yilmaz HR, Akturk O, Özgüner F, Altuntas I
J Dermatol 31 (11): 878-883
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2003,
Nadi M, Hedjiedj A, Joly L, Schmitt P, Dodinot B, Aliot E
Arch Mal Coeur Vaiss 96 (Spec. III): 22-29
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J Microw Power Electromagn Energy 36 (4): 199-215
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2001,
Lyznicki JM, Altman RD, Williams MA
Biomed Instrum Technol 35 (3): 189-195
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2000,
Reyhani SMS, Glover RJ
Electromagnetics 20 (2): 141-153
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J Microw Power 18 (2): 181-195
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2024,
Yao A, Pei Y, He J, Wang J, Yang P
IEEE Trans Electromagn Compat 66 (2): 405-416
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2024,
Woo S, Shin Y, Lee C, Moon J, Kim H, Kim H, Huh S, Ahn S
IEEE Trans Electromagn Compat [im Druck]
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2024,
Yao M, Pedersen GF, Zhang S
IEEE Trans Electromagn Compat [im Druck]
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2024,
Zhou C, Snyder DP, Epstein B, Robinson ZT, Jin GY, Tang PY, Polcawich RG, Roper M
IEEE Trans Electromagn Compat [im Druck]
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Energies 17 (1): 126
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2024,
Quercio M, Lozito GM, Corti F, Riganti Fulginei F, Laudani A
IEEE Access 12: 16728-16740
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2024,
Sufian MA, Hussain N
IEEE Trans Electromagn Compat [im Druck]
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2024,
David A, Tiemann M, Haussmann N, Stroka S, Clemens M, Schmuelling B
IEEE Ind Appl Mag 30 (1): 59-67
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2024,
Zhekov SS, Yao M, Di Paola C, Xu B, Zhang S
IEEE Trans Electromagn Compat 66 (1): 61-69
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2024,
Ardeshirpour Y, Cohen ED, Seidman SJ, Taddese B, Zaidi T, Bassen H
Bioelectromagnetics 45 (2): 70-81
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2023,
Zhou X, Dou L, Huang H, Shen Q, Zhou X, Li A, Tang W, Pang X, Zhang Y, Wu T
2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC), Hangzhou, China. IEEE: 1-5; ISBN 9798350333114