キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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2020,
Song X, Yue Y, Zhu X, Chang H
2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-4; ISBN 978-1-7281-5580-7
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2019,
Songcen W, Bin W, Xiaokang W, Chong X, Jinxing X, Weimei G, Jiaqi X
2019 22nd International Conference on Electrical Machines and Systems (ICEMS), Harbin, China. IEEE: 1-7; ISBN 978-1-7281-3399-7
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2006,
Sorri MJ, Piiparinen PJ, Huttunen KH, Haho MJ
IEEE Trans Neural Syst Rehabil Eng 14 (1): 101-108
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2023,
Souček T, Richter A, Morava J, Slavík L
2023 5th International Congress on Human-Computer Interaction, Optimization and Robotic Applications (HORA), Istanbul, Turkiye. IEEE: 1-4; ISBN 9798350337532
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2012,
Spathmann O, Hansen V, Streckert J, Zhou Y, Clemens M, Grote K, Klose M, Lerchl A
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225800; ISBN 978-1-4673-0717-8
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2024,
Sufian MA, Hussain N
IEEE Trans Electromagn Compat [in press]
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2018,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong YC
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC), Suntec City, Singapore. IEEE: 872-874; ISBN 978-1-5090-3955-5
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong RYC, Lo WK
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Angers. IEEE, Angers, France; ISBN 978-1-5386-0689-6
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2017,
Sun W, He Y, Diao Y, Leung SW, Siu YM, Kong R
2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), Seoul, Korea (South). IEEE; ISBN 978-1-5386-3913-9
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2014,
Sunohara T, Laakso I, Hirata A, Onishi T
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 449-452; ISBN 978-4-88552-287-1
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2021,
Šušnjara A, Dodig H, Poljak D, Cvetković M
IEEE Trans Electromagn Compat 63 (5): 1667-1679
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2014,
Suzuki Y, Koike A, Takamura M, Taki M, Kojima M, Sasaki K, Chakarothai J, Wake K, Watanabe S
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 832-835; ISBN 978-4-88552-287-1
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2022,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A, Shakinka I
2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 537-542; ISBN 978-1-6654-0789-2
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2021,
Svistunou A, Mordachev V, Sinkevich E, Ye M, Dubovik A
2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, Raleigh, NC, USA. IEEE: 214-219; ISBN 978-1-6654-4889-5
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2017,
Takei R, Nagaoka T, Saito K, Watanabe S, Takahashi M
IEEE Trans Electromagn Compat 59 (2): 747-753
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2012 Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, 2012. IEEE: 737-740; ISBN 978-1-4577-1557-0
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2016,
Tarmizi AI, Rotaru MD, Sykulski JK
2016 IEEE 16th International Conference on Environment and Electrical Engineering (EEEIC), Florence, Italy. IEEE: 1-6; ISBN 978-1-5090-2321-9
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2007,
Tarusawa Y, Nishiki S, Nojima T
IEEE Transactions on Vehicular Technology 56 (3): 1295-1306
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2005,
Tarusawa Y, Ohshita K, Suzuki Y, Nojima T, Toyoshima T
IEEE Trans Electromagn Compat 47 (4): 938-950
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2014,
Tateno A, Tanaka K, Nagaoka T, Watanabe S, Saito K, Takahashi M, Ito K
2014 International Symposium on Electromagnetic Compatibility, Gothenburg, Sweden. IEEE: 186-189; ISBN 978-4-88552-287-1
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2022 International Symposium on Electromagnetic Compatibility – EMC Europe, Gothenburg, Sweden. IEEE: 145-150; ISBN 978-1-6654-0789-2
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1979,
Tell RA, Mantiply ED
1979 IEEE International Symposium on Electromagnetic Compatibility, San Diego, CA, USA. IEEE: 252-256; ISBN 978-1-5090-3165-8
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2014,
Theodoridis MP, Mollov SV
Biomed Tech 59 (5): 461-469
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2008,
Thors B, Strydom ML, Hansson B, Meyer FJC, Kärkkäinen K, Zollman P, Ilvonen S, Törnevik C
IEEE Trans Electromagn Compat 50 (4): 837 - 848
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2020,
Titov EV, Soshnikov AA, Drobyazko ON
2020 International Conference on Industrial Engineering, Applications and Manufacturing (ICIEAM), Sochi, Russia. IEEE: 1-5; ISBN 978-1-7281-4591-4
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2005,
Tkalec M, Malaric K, Pevalek-Kozlina B
Bioelectromagnetics 26 (3): 185-193
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IEEE Trans Electromagn Compat 44 (1): 148-151
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1995,
Tofani S, d'Amore G, Fiandino G, Benedetto A, Gandhi OP, Chen JY
IEEE Trans Electromagn Compat 37 (1): 96-99
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2007,
Tognola G, Parazzini M, Sibella F, Paglialonga A, Ravazzani P
[詳細]
[人工内耳と電磁干渉]
[review]
Ann Ist Super Sanita 43 (3): 241-247
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2019,
Trigui A, Hached S, Ammari AC, Savaria Y, Sawan M
IEEE Rev Biomed Eng 12: 72-87
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2009,
Trinchero D, Stefanelli R, Longobardi F, Galardini A, Fiorelli B, d'Amore G, Anglesio L, Benedetto A, Trinchero S, Borsero M, Vizio G
IEEE Antennas Wirel Propag Lett 8: 224-227
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[SAR使用の限界]
[tech./dosim.]
Environmentalist 25 (2-4): 181-185
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2011,
Umberger K, Bassen HI
Biomed Eng Online 10: 66
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1992,
van Hese J, Martens L, De Zutter D, De Wagter C, Malmgren LOG, Persson BRR, Salford LG
IEEE Trans Electromagn Compat 34 (3): 292-298
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J Microw Power Electromagn Energy 36 (4): 199-215
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2017,
Vargova B, Kurimsky J, Cimbala R, Kosterec M, Majlath I, Pipova N, Tryjanowski P, Jankowiak L, Majlathova V
Syst Appl Acarol 22 (5): 683-693
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2018,
Vargová B, Majláth I, Kurimský J, Cimbala R, Kosterec M, Tryjanowski P, Jankowiak Ł, Raši T, Majláthová V
Exp Appl Acarol 75 (1): 85-95
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2015,
Vassilev A, Ferber A, Wehrmann C, Pinaud O, Schilling M, Ruddle AR
IEEE Trans Electromagn Compat 57 (6): 35-43
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2023,
Vélez RS, van Helvoort MJAM, Vogt-Ardatjew R, Van den Berg B, Leferink F
2023 International Symposium on Electromagnetic Compatibility – EMC Europe, Krakow, Poland. IEEE: 1-6; ISBN 9798350324013
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2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, Beijing, China. IEEE: 9-12; ISBN 978-1-4244-5622-2
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2019,
Viorica V, Mircea-Emilian A, Paul N, Florel R
2019 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: 1-5; ISBN 978-1-7281-4012-4
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2019,
Virjoghe EO, Bancuta I, Husu AG, Cazacu D, Florescu V
J Sci Arts No.1 (46): 249-259
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2024,
Vivarelli C, Censi F, Calcagnini G, Falsaperla R, Mattei E
Health Phys [in press]
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2024,
Vivarelli C, Censi F, Calcagnini G, Freschi F, Giaccone L, Canova A, Mattei E
IEEE Trans Electromagn Compat 66 (1): 97-107
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2023,
Vivarelli C, Censi F, Calcagnini G, Mattei E
2023 53rd European Microwave Conference (EuMC), Berlin, Germany. IEEE: 263-266; ISBN 9798350347395
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2023,
Voicu V, Dina LA, Dumbrava I, Mircea PM, Fieraru I
[電磁界の測定についての実験]
[tech./dosim.]
2023 International Conference on Electromechanical and Energy Systems (SIELMEN), Craiova, Romania. IEEE: 1-6; ISBN 9798350315257
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2023,
Voicu V, Dina LA, Mircea PM, Dumbrava I
[磁界および電界測定実験]
[tech./dosim.]
2023 Power Quality and Electromagnetic Compatibility at Low Frequency (PQEMC-LF), Craiova, Romania. IEEE: 61-64; ISBN 9798350341348
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2021,
Vu J, Nguyen BT, Bhusal B, Baraboo J, Rosenow J, Bagci U, Bright MG, Golestanirad L
IEEE Trans Electromagn Compat 63 (5): 1757-1766
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2017,
Wake K, Laakso I, Hirata A, Chakarothai J, Onishi T, Watanabe S, De Santis V, Feliziani M, Taki M
IEEE Trans Electromagn Compat 59 (2): 677 - 685
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2005,
Wallin MK, Marve T, Hakansson PK
Anesth Analg 101 (5): 1393-1400