-
2019,
Bailey WH, Bodemann R, Bushberg J, Chou CK, Cleveland R, Faraone A, Foster KR, Gettman KE, Graf K, Harrington T, Hirata A, Kavet R, Keshvari J, Klauenberg BJ, Legros A, Maxson DP, Osepchuk JM, Reilly JP, Tell RA, Thansandote A, Yamazaki K, Ziskin MC, Zollman PM
IEEE Access 7: 171346-171356
-
2019,
Fernández-Rodríguez C, Bulla G, de Salles AA
2019 49th European Microwave Conference (EuMC), Paris, France. IEEE: pp. 264-267; ISBN 978-1-7281-1798-0
-
2019,
Sekiba Y, Yamazaki K
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 83-86; ISBN 978-1-7281-1639-6
-
2019,
Gomez-Tames J, Rashed E, Hirata A, Tarnaud T, Tanghe E, Van de Steene T, Martens L, Joseph W
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 162-165; ISBN 978-1-7281-1639-6
-
[2019 Medical Technologies Congress (TIPTEKNO)], Izmir, Turkey. IEEE: pp. 1-4; ISBN 978-1-7281-2421-6
-
2019,
Makarov S, Horner M, Noetscher G
Springer International Publishing, Cham (Schweiz); ISBN 978-3-030-21292-6
-
2019,
Miwa K, Takenaka T, Hirata A
IEEE Trans Electromagn Compat 61 (6): 2024-2030
-
2019,
Kageyama I, Masuda H, Morimatsu Y, Ishitake T, Sakakibara K, Hikage T, Hirata A
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 766-769; ISBN 978-1-7281-1639-6
-
2019,
He Y, Leung PSW, Chow Y, Diao Y
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 750-753; ISBN 978-1-7281-1639-6
-
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 691-694; ISBN 978-1-7281-1639-6
-
2019,
Feng Z, Diao Y, Sun W, He Y, Leung PSW
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: pp. 48-51; ISBN 978-1-7281-1639-6
-
2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain. IEEE: pp. 1020-1024; ISBN 978-1-7281-0595-6
-
2019,
Nefzi A, Carr L, Arnaud-Cormos D, Leveque P
2019 European Microwave Conference in Central Europe (EuMCE), Prague, Czech Republic. IEEE: pp. 631-634; ISBN 978-1-7281-1240-4
-
2019,
Pääkkönen R, Korpinen L
[自動車内の低周波磁界]
[tech./dosim.]
Radiat Prot Dosimetry 187 (2): 268-271
-
2019,
Gomez-Tames J, Tarnaud T, Miwa K, Hirata A, Van de Steene T, Martens L, Tanghe E, Joseph W
IEEE Trans Electromagn Compat 61 (6): 1944 - 1952
-
2019,
Bonato M, Chiaramello E, Fiocchi S, Tognola G, Parazzini M, Ravazzani P
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: pp. 6910-3913; ISBN 978-1-5386-1312-2
-
2019,
De Angelis A, Denzi A, Merla C, Andre FM, Garcia-Sanchez T, Mir LM, Apollonio F, Liberti M
2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), Berlin, Germany. IEEE: pp. 134-137; ISBN 978-1-5386-1312-2
-
Institute of Electrical and Electronics Engineers (IEEE),
IEEE Std C95.1-2019: 1-312, ISBN 978-1-5044-5548-0
-
2019,
Orlacchio R, Zhadobov M, Alekseev SI, Nikolayev D, Sauleau R, Le Page Y, Le Dréan Y
Bioelectromagnetics 40 (8): 553-568
-
2019,
Prasad B, Kim JK, Kim S
J Oncol 2019: 9685476
-
2019,
Nagaoka T, Watanabe S
IEEE Access 7: 135909 - 135916
-
2019,
Wang HY, Li CF, Yu C, Dong J, Zou Y, Nie BB, Li JK, Ma L, Peng RY
Sci Rep 9: 13277
-
2019,
Gubernati AC, Freschi F, Giaccone L, Campi T, De Santis V, Laakso I
IEEE Trans Magn 55 (6): 5000404
-
2019,
Zucca M, Bottauscio O, Harmon S, Guilizzoni R, Schilling F, Schmidt M, Ankarson P, Bergsten T, Tammi K, Sainio P, Romero JB, Puyal EL, Pichon L, Freschi F, Cirimele V, Bauer P, Dong J, Maffucci A, Ventre S, Femia N, Di Capua G, Kuster N, Liorni I
2019 AEIT International Conference of Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE), Turin, Italy. IEEE: pp. 1-6; ISBN 978-1-7281-3278-5
-
2019,
Chiaramello E, Parazzini M, Fiocchi S, Bonato M, Ravazzani P, Wiart J
Ann Telecommun 74 (1-2): 113–121