-
2018,
Nedic G, Djuric N, Kliajic D, Kasas-Lazetic K, Pascan M
2018 26th Telecommunications Forum (TELFOR), Belgrade, Serbia. IEEE: pp. 1-4; ISBN 978-1-5386-7172-6
-
2018,
Du J, Zhen G, Chen H, Zhang S, Qing L, Yang X, Lee G, Mao HQ, Jia X
Biomaterials 181: 347-359
-
2018,
Liu J, Zheng J, Wang Q, Kainz W, Chen J
IEEE Trans Microw Theory Tech 66 (9): 4271 - 4281
-
2018,
Taphoorn MJB, Dirven L, Kanner AA, Lavy-Shahaf G, Weinberg U, Taillibert S, Toms SA, Honnorat J, Chen TC, Sroubek J, David C, Idbaih A, Easaw JC, Kim CY, Bruna J, Hottinger AF, Kew Y, Roth P, Desai R, Villano JL, Kirson ED, Ram Z, Stupp R
JAMA Oncol 4 (4): 495-504
-
2018,
Ryan HA, Hirakawa S, Yang E, Zhou C, Xiao S
IEEE Trans Biomed Circuits Syst 12 (2): 338 - 350
-
2018,
Zhang Y, Zheng N, Ma Y, Xie T, Feng X
2018 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA. IEEE: 29.3.1-29.3.4; ISBN 978-1-7281-1988-5
-
2018,
Sen R, Sarkar AK, Mandal AK, Paul LC
2018 International Conference on Innovation in Engineering and Technology (ICIET), Dhaka, Bangladesh. IEEE: pp. 1-5; ISBN 978-1-5386-5230-5
-
2018,
Shkliarskyi V, Matiieshyn Y, Grytsay V, Smarkutskyi T, Shckorbatov Y
2018 14th International Conference on Advanced Trends in Radioelecrtronics, Telecommunications and Computer Engineering (TCSET), Lviv-Slavske, Ukraine. IEEE: pp. 728-731; ISBN 978-1-5386-2557-6
-
2018,
Vrba J, Vrba Jr J, Vrba D, Merunka I, Fiser O
2018 Progress in Electromagnetics Research Symposium (PIERS-Toyama), Toyama, Japan. IEEE: pp. 1028-1033; ISBN 978-1-5386-5455-2
-
2018,
Wang M, Yang Z, Wu J, Bao J, Liu J, Cai L, Dang T, Zheng H, Li E
IEEE Trans Antennas Propag 66 (6): 3076 - 3086
