キーワード:
"electromagnetic compatibility", "elektromagnetische Verträglichkeit", EMC, EMV, 電磁両立性
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Dokument Nr. R1174712004: 1-63
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2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Melbourne, VIC. IEEE: 1-6; ISBN 978-1-5090-1885-7
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2013 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), Melbourne, VIC. IEEE: 1-4; ISBN 978-1-5090-1885-7
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2013 IEEE Antennas and Propagation Society International Symposium (APSURSI), Orlando, FL, USA. IEEE: 1432-1433; ISBN 978-1-4673-5317-5
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2013,
Higashiyama J, Tarusawa Y
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 93-98; ISBN 978-1-4673-4980-2
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International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 449-454; ISBN 978-1-4673-4980-2
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2013,
Hirata A, Tsuchida S, Laaskso I
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 89-92; ISBN 978-1-4673-4980-2
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2013,
Hikage T, Kawamura Y, Nojima T, Nagaoka T, Watanabe S
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 165-168; ISBN 978-1-4673-4980-2
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2013,
Alkahtani AA, Nordin FH, Sharrif ZAM
2013 IEEE International Conference on Control System, Computing and Engineering, Penang, Malaysia. IEEE: 321-324; ISBN 978-1-4799-1508-8
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2013,
Ruddle AR, Low L, Vassilev A
International Symposium on Electromagnetic Compatibility, Brugge, 2013. IEEE: 78-83; ISBN 978-1-4673-4980-2
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2013,
Julstrom SD, Kozma-Spytek LK, Beard BB
IEEE Electromagn Compat Mag 2 (2): 69-81
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2013,
Bullo M, Dughiero F, Sieni E
IEEE Electromagn Compat Mag 2 (2): 49-58
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IEEE Electromagn Compat Mag 2 (4): 71
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2013,
Melia GCR, Robinson MP, Flintoft ID, Marvin AC, Dawson JF
IEEE Trans Electromagn Compat 55 (6): 1043-1050
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IEEE Trans Electromagn Compat 55 (2): 275-287
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2013,
Christ A, Douglas MG, Roman JM, Cooper EB, Sample AP, Waters BH, Smith JR, Kuster N
IEEE Trans Electromagn Compat 55 (2): 265-274
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2013,
Seidman SJ, Guag JW
Biomed Eng Online 12: 71
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International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, Italy. IEEE: 1-6; ISBN 978-1-4673-0718-5
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2012,
Leung SW, Diao Y, Chan KH, Siu YM, Wu Y
IEEE Trans Biomed Eng 59 (10): 2905-2912
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2012 Asia-Pacific Symposium on Electromagnetic Compatibility, Singapore, 2012. IEEE: 737-740; ISBN 978-1-4577-1557-0
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2012,
Kim BC, Yun JH, Park SO
IEEE Trans Electromagn Compat 54 (2): 246 - 253
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2012,
Baskourelos K, Samaras T
IEEE Trans Electromagn Compat 54 (6): 1310 - 1313
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2012,
Yoshino Y, Igo S, Katsuragi M, Taki M
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225679; ISBN 978-1-4673-0717-8
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International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225695; ISBN 978-1-4673-0717-8
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2012,
Spathmann O, Hansen V, Streckert J, Zhou Y, Clemens M, Grote K, Klose M, Lerchl A
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225800; ISBN 978-1-4673-0717-8
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International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 13225691; ISBN 978-1-4673-0717-8
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2012,
Leitgeb N, Niedermayr F, Fuchs C
J Electromagn Anal 4 (2): 353-357
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[LTE端末のSAR値分析]
[tech./dosim.]
International Symposium on Electromagnetic Compatibility - EMC EUROPE, Rome, 2012. IEEE: 1-4; ISBN 978-1-4673-0717-8
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2012,
Nicolopoulou EP, Gonos IF, Stathopulos IA, Karabetsos E
IEEE Electromagn Compat Mag 1 (2): 50-59
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2012,
Bamba A, Joseph W, Andersen JB, Tanghe E, Vermeeren G, Plets D, Nielsen JO, Martens L
IEEE Trans Electromagn Compat 54 (4): 747-757
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2012,
Leitgeb N, Niedermayr F, Neubauer R
Biomed Tech 57 (3): 201-206
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2012,
Leitgeb N, Niedermayr F, Neubauer R, Loos G
J Electromagn Anal 4 (2): 96-100
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2012,
Bini M, Feroldi P, Ferri C, Ignesti A, Olmi R, Priori S, Riminesi C, Tobia L
[衛生分野での安全性および電磁両立性]
[foreign-language]
G Ital Med Lav Ergon 34 (3) Suppl: 595-598
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2012,
Censi F, Mattei E, Triventi M, Bartolini P, Calcagnini G
Expert Rev Med Devices 9 (3): 283-288
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2012,
Mattei E, Censi F, Triventi M, Bartolini P, Calcagnini G
Expert Rev Med Devices 9 (3): 289-297
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IEEE Trans Electromagn Compat 53 (3): 619 - 627
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2011,
Pignari SA, Spadacini G, Fedeli E
IEEE Trans Electromagn Compat 53 (3): 638-644
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International Organization for Standardization (ISO), International Electrotechnical Commission (IEC),
ISO/IEC TR 20017:2011: 1-56
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Association for Electrical, Electronic & Information Technologies (VDE),
VDE-AR-E 2122-4-2:2011-03
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2011,
Gosselin MC, Vermeeren G, Kuhn S, Kellerman V, Benkler S, Uusitupa TMI, Joseph W, Gati A, Wiart J, Meyer FJC, Martens L, Nojima T, Hikage T, Balzano Q, Christ A, Kuster N
IEEE Trans Electromagn Compat 53 (4): 909-922
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2011,
Barbiroli M, Carciofi C, Guiducci D
IEEE Trans Electromagn Compat 53 (1): 219-228
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2011,
Piuzzi G, Bernardi P, Cavagnaro M, Pisa S, Lin JC
IEEE Trans Electromagn Compat 53 (1): 38-47
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2011,
Conil E, Hadjem A, Gati A, Wong MF, Wiart J
IEEE Trans Electromagn Compat 53 (1): 48-52
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Health Estate 65 (1): 49-54
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2011,
Umberger K, Bassen HI
Biomed Eng Online 10: 66
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2011,
Pantchenko OS, Seidman SJ, Guag JW, Witters Jr DM, Sponberg CL
Biomed Eng Online 10: 50
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2011,
Calcagnini G, Mattei E, Censi F, Triventi M, Lo Sterzo R, Marchetta E, Bartolini P
Health Phys 100 (5): 497-501
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2011,
De Santis V, Beeckman PA, Lampasi DA, Feliziani M
IEEE Trans Biomed Eng 58 (2): 390-396
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2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, Beijing, China. IEEE: 9-12; ISBN 978-1-4244-5622-2
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German Commission for Electrical, Electronic & Information Technologies of DIN and VDE (DKE),
DIN EN 60601-1-2 VDE 0750-1-2 Berichtigung 1:2010-05