キーワード:
比吸収率, "Spezifische Absorptionsrate", SAR, "specific energy absorption rate", "specific absorption rate", 比エネルギー吸収率
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Electromagn Biol Med 41 (1): 60-70
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2021,
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Indian J Pure Appl Phys 59 (11): 744-751
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2017 IEEE MTT-S International Microwave and RF Conference (IMaRC), Ahmedabad, India. IEEE: 267-270; ISBN 978-1-5386-1321-4
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2023,
Naik NC, Sahu NK, Patra TK
2023 International Conference on Communication, Circuits, and Systems (IC3S), BHUBANESWAR, India. IEEE: 1-5; ISBN 9798350325911
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2003,
Nakamura H, Matsuzaki I, Hatta K, Nobukuni Y, Kambayashi Y, Ogino K
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2022,
Nakamura M, Ikeda A, Tajima T, Seyama M
2022 Asia-Pacific Microwave Conference (APMC), Yokohama, Japan. IEEE: 940-942; ISBN 978-1-6654-5108-6
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2020,
Nakatani-Enomoto S, Yamazaki M, Nishiura K, Enomoto H, Ugawa Y
Neurosci Res 156: 102-107
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2016,
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Bioelectromagnetics 37 (6): 373-381
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2022 2nd Asian Conference on Innovation in Technology (ASIANCON), Ravet, India. IEEE: 1-5; ISBN 978-1-6654-6852-7
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2023,
Nandikanti A, Zheng J, Hu W, Chen J
2023 United States National Committee of URSI National Radio Science Meeting (USNC-URSI NRSM), Boulder, CO, USA. IEEE: 81-82; ISBN 978-1-6654-7642-3
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2024,
Naqvi SAR, Mobashsher AT, Mohammed B, Foong D, Abbosh A
IEEE Trans Instrum Meas [in press]
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2022,
Narasimman S, Karuppanan S
Int J RF Microw Comput Aided Eng 32 (12): e23545
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2022,
Narayan R, Kundu D, Ghatak A, Tripathi S, Datta S
J Hosp Infect 129: 17-21
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2015,
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Metab Brain Dis 30 (5): 1193-1206
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2023,
Naresh Chandra Naik, Nibash Kumar Sahu, Tapas Kumar Patra
2023 1st International Conference on Circuits, Power and Intelligent Systems (CCPIS), Bhubaneswar, India. IEEE: 1-5; ISBN 9798350315776
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2018 3rd International Conference and Workshops on Recent Advances and Innovations in Engineering (ICRAIE), Jaipur, India. IEEE: 1-6; ISBN 978-1-5386-4526-0
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2020 IEEE 92nd Vehicular Technology Conference (VTC2020-Fall), Victoria, BC, Canada. IEEE: 1-5; ISBN 978-1-7281-9485-1
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2019 SoutheastCon, Huntsville, AL, USA. IEEE: 1-6; ISBN 978-1-7281-0138-5
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MILCOM 2019 - 2019 IEEE Military Communications Conference (MILCOM), Norfolk, VA, USA. IEEE: 1-6; ISBN 978-1-7281-4281-4
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Ann Telecommun 74 (1-2): 45–52
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2012,
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2002,
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2016,
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2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Honolulu, HI, USA. IEEE; ISBN 978-1-5090-6186-0
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2020,
Navarro de Lara LI, Golestanirad L, Makarov SN, Stockmann JP, Wald LL, Nummenmaa A
Magn Reson Med 84 (2): 1061-1075