Die folgenden Begriffe wurden einbezogen:
Dezibel, dB, decibel, デシベル
-
2022,
Saha R, Mirbozorgi SA
2022 20th IEEE Interregional NEWCAS Conference (NEWCAS), Quebec City, QC, Canada. IEEE: 389-392; ISBN 978-1-6654-0106-7
-
2023,
Sahoo P, Singhal PK
2023 IEEE 3rd International Conference on Applied Electromagnetics, Signal Processing, & Communication (AESPC), Bhubaneswar, India. IEEE: 1-4; ISBN 9798350358759
-
2022,
Saleeb DA, Helmy RM, Areed NFF, Marey M, Almustafa KM, Elkorany AS
IEEE Access 10: 78102-78113
-
2003,
Salford LG, Brun AE, Eberhardt JL, Malmgren L, Persson BR
Environ Health Perspect 111 (7): 881-883
-
IET Microwaves, Antennas & Propagation 14 (2): 177-184
-
2021,
Samaras T, Christ A, Kuster N
Bioelectromagnetics 42 (6): 484-490
-
2011,
Sambucci M, Laudisi F, Nasta F, Pinto R, Lodato R, Lopresto V, Altavista P, Marino C, Pioli C
Prog Biophys Mol Biol 107 (3): 393-398
-
2022,
Sanchez Aquino JM, Arroyo Pizarro A, Amaya Fariño LM, Jaramillo Chamba DA, Jaramillo Infante MK
Guarda T, Portela F, Augusto MF (Hrsg.): Advanced Research in Technologies, Information, Innovation and Sustainability. Communications in Computer and Information Science, Band 1676; Springer, Cham; 205-217; ISBN 978-3-031-20315-2
-
2019,
Sang M, Wang S, Liu S, Liu M, Bai L, Jiang W, Xuan S, Gong X
ACS Appl Mater Interfaces 11 (50): 47340-47349
-
2015,
Sangun O, Dundar B, Darici H, Comlekci S, Doguc DK, Celik S
Electromagn Biol Med 34 (1): 63-71
-
2023,
Sankar Ponnapalli VA, Reddy GS, Rohith Goud PS, Saharsh P, Praveena A
2023 International Conference on Computer Communication and Informatics (ICCCI), Coimbatore, India. IEEE: 1-5; ISBN 9798350348224
-
2016,
Santos-Pontelli TE, Rimoli BP, Favoretto DB, Mazin SC, Truong DQ, Leite JP, Pontes-Neto OM, Babyar SR, Reding M, Bikson M, Edwards DJ
PLoS One 11 (3): e0152331
-
2024,
Särestöniemi M, Singh D, Dessai R, Heredia C, Myllymäki S, Myllylä T
Sensors 24 (6): 1975
-
2013,
Saritas EU, Goodwill PW, Zhang GZ, Conolly SM
IEEE Trans Med Imaging 32 (9): 1600-1610
-
2012,
Saritas EU, Goodwill PW, Zhang GZ, Yu W, Conolly SM
Magnetic Particle Imaging. A Novel SPIO Nanoparticle Imaging Technique. Springer: 325-330; ISBN 978-3-642-24133-8
-
2020,
Sarkar P, Hasan RR, Sinha S, Rahman MA, Niloy TSR
2020 IEEE Region 10 Symposium (TENSYMP), Dhaka, Bangladesh. IEEE: 1498-1501; ISBN 978-1-7281-7367-2
-
2019,
Sasaki K, Li K, Wake K, Watanabe S, Higashiyama J, Onishi T
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), Sapporo, Japan. IEEE: 43-46; ISBN 978-1-7281-1639-6
-
2015,
Saygin M, Caliskan S, Ozguner MF, Gumral N, Comlekci S, Karahan N
West Indian Med J 64 (2): 55-61
-
2000,
Scanlon WG, Burns JB, Evans NE
IEEE Trans Biomed Eng 47 (4): 527-534
-
2014,
Schaap K, Christopher-De Vries Y, Crozier S, de Vocht F, Kromhout H
Ann Occup Hyg 58 (9): 1094-1110
-
2000,
Schaefer DJ, Bourland JD, Nyenhuis JA
J Magn Reson Imaging 12 (1): 20-29
-
2023,
Schilling LM, Bornkessel C, Schiffarth AM, Heberling D, Hein MA
2023 17th European Conference on Antennas and Propagation (EuCAP), Florence, Italy. IEEE: 1-5; ISBN 978-1-6654-7541-9
-
2013,
Schlisselberg DB, Kler E, Kalily E, Kisluk G, Karniel O, Yaron S
Int J Food Microbiol 160 (3): 219-226
-
2022,
Schmid G, Hirtl R, Gronau I, Meyer V, Drees K, Lerchl A
Bioelectromagnetics 43 (1): 25-39
-
2020,
Schmid G, Hirtl R, Bueno-Lopez A, Dorn H, Eggert T, Danker-Hopfe H
Bioelectromagnetics 41 (3): 230-240
-
2019,
Schmid G, Hirtl R, Samaras T
J Radiol Prot 39 (3): 794-808
-
2019,
Schmid G, Hirtl R, Samaras T
J Radiol Prot 39 (2): 455-469
-
2007,
Schmid G, Cecil S, Goger C, Trimmel M, Kuster N, Molla-Djafari H
Bioelectromagnetics 28 (8): 636-647
-
2005,
Schmid G, Sauter C, Stepansky R, Lobentanz IS, Zeitlhofer J
Bioelectromagnetics 26 (4): 243-250
-
2012,
Schmid MR, Murbach M, Lustenberger C, Maire M, Kuster N, Achermann P, Loughran SP
J Sleep Res 21 (6): 620-629
-
1980,
Schrot J, Thomas JR, Banvard RA
Bioelectromagnetics 1 (1): 89-99
-
2007,
Schubert M, Bornkessel C, Wuschek M, Schmidt P
Radiat Prot Dosimetry 124 (1): 53-57
-
2004,
Schuderer J, Oesch W, Felber N, Spät D, Kuster N
Bioelectromagnetics 25 (8): 582-591
-
1994,
Seaman RL, Beblo DA, Raslear TG
Physiol Behav 55 (3): 587-595
-
2020,
Serghiou D, Khalily M, Singh V, Araghi A, Tafazolli R
IEEE Antennas Wirel Propag Lett 19 (9): 1546-1550
-
1988,
Severson RK, Stevens RG, Kaune WT, Thomas DB, Heuser L, Davis S, Sever LE
Am J Epidemiol 128 (1): 10-20
-
2023,
Shabeeb Ahamed KP, Britto JP, Arunachalam K
IEEE J Electromagn RF Microw Med Biol 7 (4): 375-382
-
2022,
Shabeeb Ahamed KP, Arunachalam K
2022 IEEE Microwaves, Antennas, and Propagation Conference (MAPCON), Bangalore, India. IEEE: 449-453; ISBN 978-1-6654-5204-5
-
2022,
Shabeeb Ahamed KP, Arunachalam K
IEEE Trans Antennas Propag 70 (9): 7745-7754
-
2018,
Shah AD, Morris MA, Hirsh DS, Warnock M, Huang Y, Mollerus M, Merchant FM, Patel AM, Delurgio DB, Patel AU, Hoskins MH, El Chami MF, Leon AR, Langberg JJ, Lloyd MS
Heart Rhythm 15 (7): 1001-1008
-
2017,
Shah AD, Patel AU, Knezevic A, Hoskins MH, Hirsh DS, Merchant FM, El Chami MF, Delurgio DB, Patel AM, Leon AR, Langberg JJ, Lloyd MS
Pacing Clin Electrophysiol 40 (5): 467-475
-
2024,
Shah SAA, Shah IA, Hayat S, Yoo H
IEEE Trans Antennas Propag 72 (2): 1352-1362
-
2022,
Shah SMA, Zada M, Nasir J, Owais, Yoo H
IEEE Access 10: 90971-90981
-
2023,
Shah SN, Zada M, Nasir J, Shah SMA, Arnieri E, Yoo H
IEEE Access 11: 104622-104632
-
2021,
Shahzad MA, Paracha KN, Naseer S, Ahmad S, Malik M, Farhan M, Ghaffar A, Hussien M, Sharif AB
Electronics 10 (23): 2908
-
2022,
Shamsuri Agus ANS, Sabapathy T, Jusoh M, Abdelghany MA, Hossain K, Padmanathan S, Al-Bawri SS, Soh PJ
Polymers 14 (10): 1989
-
2019,
Shang W, Chen G, Li Y, Zhuo Y, Wang Y, Fang Z, Yu Y, Ren H
J Diabetes Res 2019: 5641271
-
2024,
Sharma D, Tiwari RN, Kanaujia BK, Kumar S, Rambabu K
IEEE Internet Things J 11 (5): 9072-9085
-
2022,
Sharma D, Chauhan A, Thakur S
Indian J Otolaryngol Head Neck Surg 74 Suppl 3: 3754-3757
-
2023,
Sharma MK, Singh SP, Badola P, Kumar M, Saini JP, Lay-Ekuakille A
IEEE Sens J 23 (17): 20207-20214